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Product Descriptions

  ARCHE has commercialized SiC Epitaxy products through 10 years of research and development. Through ARCHE’s technical expertise and state-of-the-art Epi growth equipment, 

        we deliver the excitement of high-quality SiC Epitaxy to our customers.
        We are developing SiC Epitaxy wafers for high-performance power semiconductor devices and provide epitaxy processes of 15 or more for ultra-high voltage devices,          
        meeting customers' performance and quality requirements.

 

    Key Features

   • 4H Single-crystal
   • 150 Wafers
   • n-type
   • 4˚ off-axis


 Division Spec. ① Spec.
   Epitaxy Thickness 6 ~ 15 ㎛ 16~25㎛
     All epilayers thickness max deviation ≤10% ≤12%
     All epilayers thickness uniformity (sigma/mean) ≤5% ≤7%
   Epitaxy doping concentration 5E14~7E18/ 5E14~7E18/
     Epilayer net target doping max deviation ≤15% ≤18%
     Epilayer net doping uniformity (sigma/mean) ≤7% ≤9%
   Buffer layer Thickness 1(±10%) 1(±10%)
   Buffer layer doping concentration 1E18/(±20%) 1E18/(±20%)
   Surface Roughness(㎚, RMS, by AFM) ≤1 ≤1
   LLS Site Yield (2 ㎜ x 2 ㎜) > 92% > 87%
   Scratches (cumulative) <30 <30
   Bow (㎛) ±30 ±34
   Warp (㎛) ≤48 ≤55
   TTV (㎛) ≤10 ≤11
   SBIR (㎛) ≤2 ≤2